Soder-Wick No Clean Desoldering Wick

Chemtronics / Chemtronics Soder-Wick

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      Soder-Wick No Clean Desoldering Wick

      Soder-Wick No Clean desoldering wick is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean desoldering wick uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid.

      Soder-Wick brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

      Features & Benefits

      • Patented noncorrosive, halide-free, organic no-clean flux
      • Desolders up to 40% faster than competitive no-clean braids
      • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Resistance

      Specifications

      • MIL-F-14256 F
      • NASA-STD-8739.3 Soldered Electrical Connections
      • DOD-STD-883E, Method 2022
      • ANSI/IPC J STD-004, Type ROL0
      • Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818

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