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Millice Group Products
Learn about the Millice Group products offered by CE3S.
CE3S Partner
Millice Group Supplies Wafer Dicing and Bonding Products
Wafer dicing, temporary wafer bonding and debonding, and wire and die bonding are the focus of the Millice Group products on this page. The lineup includes KerfAid dicing surfactants, HiSpec surfactant injectors, WaferGrip adhesive, the DXB-880 bonder, StripAid solvent, and precision bonding tools.
Cumberland Electronics Strategic Supply Solutions (CE3S) supplies every Millice Group product on this page, and each one has a PDF you can download. Tell us about your substrates, saws, or bonding process, and we’ll help you narrow down the right product and set up a demo or quote.
Why Order Millice Through CE3S
- Family-owned and serving manufacturers since 1962
- Help choosing and cross-referencing parts
- No minimum order constraints
- One point of contact from quote to delivery
- 350+ product lines on one account
With Corrosion Inhibitor
KerfAid ’000 Series
KerfAid ’000 is a wafer dicing surfactant with a corrosion inhibitor. It combines cleaning, lubrication, and process control to deal with debris build-up, galvanic corrosion, and electrostatic discharge.
Its high-molecular-weight lubricant stays in place during dicing, which reduces friction and extends blade life, while a triple-surfactant blend clears swarf and protects a range of hard, brittle substrates. KerfAid Advanced also controls corrosion and static, reducing bond failures and improving conductivity.
Features and Highlights
- Reduces chipping and micro-cracking
- Prevents electrostatic discharge and staining
- Controls corrosion for better bond durability
- Lubrication that extends blade life
- Works on silicon carbide, sapphire, and more
Without Corrosion Inhibitor
KerfAid ’00 Series
KerfAid ’00 has no corrosion inhibitor. Its proprietary triple-surfactant blend handles chipping, micro-cracking, and debris contamination in challenging wafer dicing jobs, and it improves blade life and cooling.
This formula lubricates and cleans across a wide range of hard or brittle substrates, including silicon carbide, sapphire, and lithium-based materials. By reducing friction, improving water conductivity, and controlling electrostatic discharge, KerfAid Advanced keeps wafer surfaces clean and ready for bonding.
Features and Highlights
- Reduces chipping and micro-cracking
- Eliminates debris contamination
- Extends blade life and improves cooling
- Improves water flow and particle removal
- Controls electrostatic discharge and staining
HiSpec XA1 Injector
ImageTransforms’ HiSpec XA1 Injector doses surfactant precisely, straight into dicing saws or DI water lines. It keeps operation simple, with adjustable dosing rates and support for multiple container sizes.
Automatic safety measures like flow detection and low-level sensors help prevent interruptions, and the cleanroom-ready housing fits into your process.
Features and Highlights
- Compact, space-saving design
- Adjustable dosing rates and stroke speeds
- Fits 1-gallon and 5-gallon surfactant containers
- Automatic safety shutdown with flow monitoring
- Static mixer for consistent solutions
HiSpec XI Injector
For wafer dicing, the ImageTransforms HiSpec XI Injector brings precise, consistent surfactant dosing straight into water streams. Its modular structure makes maintenance simpler.
A touchscreen interface, custom programming, and automatic warnings make it easy to run, and the mobile design adapts to different setups.
Features and Highlights
- Supports up to 4 metering surfactant pumps
- 7-inch touchscreen for system control
- Doses directly from the surfactant canister
- Alarm and safety systems
- Modular design for easier upgrades and maintenance
HiSpec XP Injector
The ImageTransforms HiSpec XP Injector doses pre-mixed surfactant directly to the saws for precise, flexible control over wafer dicing. Custom programming and a touchscreen interface cut down on manual handling, and it fits into existing setups.
Separate electrical and pump modules allow quick maintenance swaps, and the unit holds up to four pumps. Alarm systems, emergency shutoffs, and leak detection are built into a durable, mobile frame.
Features and Highlights
- Precise, automated dosing of pre-mixed surfactant
- Fits existing wafer dicing systems
- Touchscreen interface for custom programming
- Holds up to four pumps to feed multiple dicing saws
- Safety and alert systems that minimize downtime
Request Info or a Demo
Tell us which Millice product you’re looking at and we’ll send details or set up a hands-on demo.
WaferGrip™ Temporary Adhesive
WaferGrip adhesives use heat-activated ethylene vinyl acetate (EVA) polymers to hold wafers and substrates temporarily during thinning, dicing, and lapping. Release paper suits standard uses, Mylar™ suits cutting applications, and double-sided Mylar™ adds protection.
To bond, heat WaferGrip with light pressure in a vacuum chamber for 30 to 60 seconds at 100 to 140°C. It resists chemicals like IPA and acetone and keeps for 1.5 years in cool, dry storage.
Features and Highlights
- Heat-activated EVA polymers for temporary bonding
- Standard, Conductive, and High Temp formulations
- On release paper or single or double-sided Mylar™
- Applied at 100 to 140°C in a vacuum chamber
- Resists water, acetone, and other chemicals
DXB-880 Wafer Bonder
The DXB-880 Wafer Bonder automates void-free wafer bonding for wafer thinning, dicing, and metal plating. You control temperature, pressure, and duration precisely, settings are password-protected, and the display shows progress in real time.
Active cooling brings cooling times down to 6 to 10 minutes, and the dual-chamber design keeps air from getting trapped in the bondline. The unit is compact and easy to use.
Specifications
- Chamber 11 inches in diameter
- Temperature range of 100 to 356°F (40 to 180°C)
- Cycle times from 1 minute to 10 hours
- Two independent vacuum supplies at 25 inHg
- Runs on 100/120 or 220/240 VAC by model
StripAid™ X Series Specialty Solvent
StripAid™ X Series is a biodegradable hydrocarbon solvent made for debonding WaferGrip adhesives. It’s nonhazardous and environmentally considerate for lab use, works at room temperature or heated, and supports ultrasonic agitation.
It’s especially effective for debonding diced and whole wafers, such as after wafer thinning. Soak the wafers in StripAid at 110°C for 5 to 20 minutes, then rinse with acetone, IPA, and DI water. Negligible water solubility and low vapor pressure make it easy to handle without special precautions. Store it out of direct sunlight, ideally at 20 to 25°C.
Features and Highlights
- Biodegradable solvent for debonding WaferGrip
- Works at various temperatures and with ultrasonics
- Sequential soak and rinse process for clean results
- Nonhazardous formula that simplifies handling
- Store away from sunlight at moderate temperatures
Millice Capillaries
Zirconium-toughened alumina (ZTA) gives these ceramic capillaries consistent results and a long service life at a competitive cost. Aperture size, wire spacing, and surface finish can be tailored to gold, silver, copper, and LED alloy wires.
A Ruby ZTA version lasts even longer in demanding use. Millice’s support team also helps solve production challenges to keep efficiency up without giving up quality.
Features and Highlights
- Zirconium-toughened alumina (ZTA) for strength
- Surface finishes for multiple wire materials
- Long lifespan with gold, silver, and copper wire
- Ruby ZTA for extended durability in harsh conditions
- Custom specifications to fit diverse needs
Millice EFO Wand
Made from iridium, platinum, or iridium alloy, the Millice EFO Wand lasts up to twice as long as traditional steel. Each wand is polished for accurate spark direction, then aged and inspected for reliability.
Features and Highlights
- Iridium, platinum, or alloy construction
- Cone or sphere tip shape
- Polished for consistent spark directionality
- Up to 2X the lifespan of steel
- Thoroughly aged and inspected for reliability
Get Pricing on Millice Products
Send the product names or part numbers you need and we’ll put a quote together.
Millice Wedge Bonding Tools
Millice wedge bonding tools connect aluminum, copper, and gold wires in modern semiconductor manufacturing. They place wire precisely and shape loops smoothly for reliable connections in demanding applications, and the Pocket, V-notch, and No Inner Hole designs each suit specific bonding needs.
Features and Highlights
- Pocket, V-notch, and No Inner Hole types
- Accurate wire placement and loop shaping
- Made for modern semiconductor manufacturing
- Bright, matte, and other surface finishes
- Range of wire feed angles and bond lengths
Millice Ceramic Spring Nozzle
Built for semiconductor packaging and LED chip production, the Millice Ceramic Spring Nozzle resists high heat. Its spring strength can be customized for delicate handling, and its design prevents blockages and back-sucking.
It delivers consistent performance for over five million uses. The ZTA material is very hard and wear-resistant, and a range of models covers different bonding and adhesive applications.
Features and Highlights
- Reduces defects
- Strong suction for LED and IC wafers
- Long-lasting performance
- Adjustable spring strength
- Smooth material release
Millice Bonding Collet
Backed by 26 years of experience, Millice bonding collets come in rectangular, flat, and 4-side styles, with classic and custom designs for different bonding requirements. They’re precision-made to hold up and stay accurate in industrial use.
Features and Highlights
- Backed by 26 years of experience
- Rectangular, flat, and 4-side collets
- Classic and custom designs
- Precision engineering for consistent results
- Durable and reliable in industrial use
About Millice
Wafer Processing Is the Millice Group’s Specialty
Lubricants, surfactants, injectors, temporary adhesives, bonding equipment, specialty solvents, and precision bonding tools make up the Millice Group’s wafer processing lineup. These products are designed to improve efficiency, reduce defects, and sharpen precision. They address debris management, corrosion control, static discharge prevention, and reliable bonding in semiconductor manufacturing and advanced materials processing.
CE3S Partner
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Ask About Millice Group Products
Fill out the form and a CE3S team member will follow up about Millice Group dicing, bonding, and debonding products, including pricing and demos.
- Send the form, call, or email us.
- We confirm the products and part numbers for your request.
- You get a quote and one CE3S contact for the order.
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