Millice Group Products

Learn about the Millice Group Products offered by CE3S.

KerfAid ‘000 Series

The KerfAid ‘000 series with corrosion inhibitor delivers a game-changing solution for wafer dicing challenges by combining superior cleaning power, cutting-edge lubrication, and exceptional process control, all while addressing issues like debris build-up, galvanic corrosion, and electrostatic discharge. Its high-molecular-weight lubricant stays in place during operations, reduces friction, and extends blade life, while its triple-surfactant blend eliminates swarf and prevents damage to a variety of hard and brittle substrates. KerfAid Advanced also offers advanced corrosion and static control, reducing bond failures and enhancing conductivity for seamless operations.

  • Reduces chipping and micro-cracking
  • Removes debris contamination
  • Prevents electrostatic discharge and staining
  • Extends blade life with high-molecular-weight lubrication
  • Effective across diverse substrates like silicon carbide and sapphire
  • Controls corrosion for improved bond durability
  • Enhances conductivity in cutting water

KerfAid ’00 Series

The KerfAid ’00 series without corrosion inhibitor delivers exceptional performance for challenging wafer dicing applications with its proprietary triple surfactant blend, tackling issues like chipping, micro-cracking, and debris contamination while enhancing blade longevity and cooling efficiency. This innovative formula offers unparalleled lubrication and cleaning, ensuring smooth operations across a wide range of hard or brittle substrates such as silicon carbide, sapphire, and lithium-based materials. By reducing friction, improving water conductivity, and controlling electrostatic discharge, KerfAid Advanced keeps wafer surfaces clean and bond-ready, making it an essential solution for precision manufacturing.

  • Reduces defects for pristine results
  • Superior suction for LED and IC wafers
  • Long-lasting performance
  • Adjustable spring strength
  • Smooth material release

HiSpec XA1 Injector

The ImageTransforms HiSpec XA1 Injector offers precise dosing of surfactant directly into dicing saws or DI water lines, blending innovative features with simplicity for optimal performance. It supports adjustable dosing rates, operates with multiple container sizes, and comes with automated safety measures like flow detection and low-level sensors to prevent interruptions, all housed in a cleanroom-ready design for seamless integration into your process.

  • Compact and space-efficient design
  • Adjustable dosing rates and stroke speeds
  • Compatible with 1-gallon and 5-gallon surfactant containers
  • Automatic safety shutdown for flow and supply monitoring
  • Efficient static mixer for consistent solutions
  • Durable construction with corrosion-resistant materials

HiSpec XI Injector

The ImageTransforms HiSpec XI Injector is a cutting-edge surfactant injector system designed to bring precision and consistency to wafer dicing processes, offering direct dosing into water streams while simplifying maintenance with its modular structure; it combines user-friendly features like a touchscreen interface, customizable programming, and automated warnings, all in a mobile and adaptable design that integrates seamlessly into various setups.

  • Works with up to 4 metering surfactant pumps
  • Features a 7-inch touchscreen for system control
  • Automates dosing directly from the surfactant canister
  • Includes advanced alarm and safety systems
  • Modular design streamlines upgrades and maintenance
  • Built with durable materials for reliable performance
  • Compact and mobile with integrated wheels

HiSpec XP Injector

The ImageTransforms HiSpec XP Injector is an innovative dicing solution injector that delivers precision and flexibility for wafer dicing operations, offering automated pre-mixed surfactant dosing directly to the saws for unparalleled control and efficiency. With features like customizable programming, seamless integration into existing setups, and an intuitive touch-screen interface, it minimizes manual handling and enhances operational performance. Designed with separate electrical and pump modules, it supports quick maintenance swaps and accommodates up to four high-quality pumps. Safety is prioritized through advanced alarm systems, emergency shutoffs, and leak detection, all housed within a durable, mobile structure that adapts effortlessly to dynamic environments.

  • Offers precise, automated pre-mixed surfactant dosing
  • Integrates seamlessly with existing wafer dicing systems
  • Enables customization through an intuitive touch-screen interface
  • Supports quick maintenance with modular design
  • Minimizes downtime with advanced safety and alert systems
  • Built for durability and easy repositioning within facilities
  • Accommodates up to four pumps, feeding multiple dicing saws

WaferGrip™ Temporary Adhesive

WaferGrip adhesives use heat-activated Ethylene Vinyl Acetate (EVA) polymers to bond wafers and substrates temporarily, supporting wafer thinning, dicing, and lapping. These adhesives are available in Standard, Conductive, and High Temp formulations and three configurations: release paper for standard uses, Mylar™ for cutting applications, and double-sided Mylar™ for added protection. Precise bonding is achieved by heating WaferGrip with light pressure in a vacuum chamber for 30-60 seconds at 100°C–140°C. Removal involves Dynatex’s StripAid solvent. WaferGrip is highly resistant to chemicals like IPA and acetone, and it can be stored for 1.5 years under cool, dry conditions.

  • Made from heat-activated EVA polymers for temporary wafer bonding.
  • Available in Standard, Conductive, and High Temp formulations.
  • Offered in configurations: release paper, single or double-sided Mylar™.
  • Applied at 100°C–140°C using light pressure and a vacuum chamber.
  • Resistant to water, acetone, other chemicals, with a 1.5-year shelf life.
  • Removal is facilitated using Dynatex’s StripAid solvent.

DXB-880 Wafer Bonder

The DXB-880 Wafer Bonder is an automated system for void-free wafer bonding, supporting applications like wafer thinning, dicing, and metal plating. It offers precise control over temperature, pressure, and duration, with password-protected settings and real-time progress display. Active cooling reduces cooling times to 6-10 minutes, while the dual-chamber design prevents air entrapment in the bondline. With a temperature range of 100-356°F, cycle times from 1 minute to 10 hours, and compact dimensions, the DXB-880 combines precision and ease of use for versatile bonding processes.

  • Chamber size: 11 inches in diameter.
  • Temperature range: 100-356°F (40-180°C).
  • Cycle time: 1 minute to 10 hours.
  • Power: Requires 100/120 or 220/240 VAC depending on the model.
  • Vacuum: Two independent supplies at 25 inHg.
  • Coolant: Water flow of 12 liters per minute at 40 psi.
  • Environmental conditions: 60-80°F, 0-95% humidity (non-condensing)​

StripAid™ X Series Specialty Solvent

StripAid™ X Series is a biodegradable hydrocarbon solution specifically created for debonding WaferGrip adhesives, offering a nonhazardous and environmentally considerate choice for laboratory use. It excels in versatility, working at both ambient and elevated temperatures, and supports ultrasonic agitation. This solvent is especially effective for debonding both diced and whole wafers, such as after the wafer thinning process. The process involves soaking wafers in StripAid at 110°C for 5 to 20 minutes, followed by rinses with acetone, IPA, and DI water. With negligible solubility in water and low vapor pressure, it is easy to handle without special precautions. Storage requires protection from direct sunlight, with an optimal temperature range of 20°C to 25°C.

  • Biodegradable solvent suitable for debonding WaferGrip adhesives.
  • Operates at various temperatures and with ultrasonic agitation.
  • Process involves sequential soaking and rinsing for clean results.
  • Nonhazardous formulation simplifies handling and safety protocols.
  • Requires storage away from direct sunlight at moderate temperatures

Millice Capillaries

Millice offers high-performance ceramic capillaries made with advanced zirconium-toughened alumina (ZTA) to deliver consistent results and long service life at a competitive cost. These capillaries are optimized for various applications with tailored options for aperture size, wire spacing, and surface finishes to suit materials like gold, silver, copper, and LED alloy wires. Backed by a professional support team, Millice addresses production challenges to boost efficiency while maintaining product quality. The Ruby ZTA variant offers even longer durability for demanding use cases.

  • Zirconium-toughened alumina (ZTA) for strength and chemical stability
  • Variety of surface finishes for compatibility with multiple wire materials
  • Long lifespan for gold, silver, and copper wire applications
  • Customizable specifications to fit diverse needs
  • Cost-efficient with consistent performance
  • Ruby ZTA available for extended durability in harsh conditions
  • Professional support team resolves production challenges efficiently

Millice EFO Wand

Experience exceptional longevity and precision with the Millice EFO Wand, crafted from premium Iridium, Platinum, or Iridium alloy to double the lifespan of traditional steel alternatives, polished with decades of expertise for unmatched spark accuracy, and rigorously aged and inspected for outstanding reliability and performance.

  • Built with Iridium, Platinum, or alloy options
  • Offers two distinct tip shapes: cone and sphere
  • Polished for consistent spark directionality
  • Features up to 2X the lifespan of steel materials
  • Thoroughly aged and inspected for reliability

Millice Wedge Bonding Tools

Millice introduces wedge bonding tools built to connect aluminum, copper, and gold wires for modern semiconductor manufacturing. These tools provide precise wire placement and smooth loop shaping for reliable connections in demanding applications. The designs include Pocket, V-notch, and No Inner Hole types, each tailored to specific bonding needs, offering versatility and practicality.

  • Available in three types: Pocket, V-notch, and No Inner Hole
  • Offers accurate wire placement and loop shaping
  • Tailored for modern semiconductor manufacturing
  • Different surface finishes, including bright and matte
  • Supports various wire feed angles and bond lengths

Millice Ceramic Spring Nozzle

The Millice Ceramic Spring Nozzle revolutionizes semiconductor packaging and LED chip production by combining exceptional performance, durability, and precision. With advanced features like high heat resistance, customizable spring strength for delicate handling, and an innovative design that prevents blockages and back-sucking, it delivers consistent, long-lasting performance for over five million uses. Its ZTA material offers unmatched hardness and wear resistance, while a range of models supports diverse bonding and adhesive applications, making it an ideal solution for demanding environments.

  • Reduces chipping and micro-cracking
  • Eliminates debris contamination
  • Enhances cooling and blade lifespan
  • Improves water flow and particle removal
  • Controls electrostatic discharge and staining
  • Supports diverse substrates effectively

Millice Bonding Collet

Millice offers cutting-edge rectangular, flat, and 4-side bonding collets crafted with precision and backed by 26 years of expertise, providing unparalleled performance tailored to meet diverse bonding requirements with options for both classic and custom designs, ensuring high durability and consistent accuracy for various industrial applications.

  • Backed by 26 years of experience
  • Wide range of rectangular, flat, and 4-side collets
  • Available in classic and customized designs
  • Precision engineering for consistent results
  • Crafted for durability and reliability in industrial use

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    Try Our Millice Group Products

    The Millice Group provides specialized, high-performance wafer processing solutions including lubricants, surfactants, injectors, temporary adhesives, bonding equipment, specialty solvents, and precision bonding tools. Engineered to improve efficiency, reduce defects, and enhance precision, these products address challenges such as debris management, corrosion control, static discharge prevention, and reliable bonding in semiconductor manufacturing and advanced materials processing.

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